Flat target VS rotating target
Planar target and rotating target are two common sputtering targets, which have their own characteristics in structure and application.
A planar target is an experimental tool used in the study of substances, usually placed in the target chamber. It is made of pure material and presents a fixed flat form. In material research, planar targets are often used in experiments such as sputtering deposition and ion beam bombardment, through which researchers can obtain relevant information such as the composition and structure of materials. A significant advantage of this kind of target is its simple structure and strong versatility, which makes the uniformity and repeatability of the film layer good. However, one significant disadvantage is the low target utilization rate, usually only about 20%. When the glow area (magnetic field distribution area) of the target is consumed to a certain extent, it will form a strip of pits, making the target thin. When the pit depth reaches a certain value, the target can no longer be used.
A rotating target is a type of rotating target that can rotate at different speeds and directions. This design allows a more even distribution of the substance on the target. The main advantages of rotating targets over flat targets are their compact structure and higher target utilization. This means that rotating targets can solve the problem of low utilization of flat targets. However, rotating targets also have some disadvantages. For example, when sputtering, the entire surface of the target will produce many glow rings, resulting in the inability to form a continuous banded glow. Therefore, when coating a large area of film, the uniformity of the film surface may be poor, and it is difficult to meet some specific needs.
